Mounting Reliability Package - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

High Implementation Reliability Package [Patented Technology]

High implementation reliability! Effective for miniaturization and low-profile packaging for automotive applications!

Our company offers a non-lead package with high mounting reliability that utilizes patented technology to improve durability against mechanical stress such as substrate warping and twisting, thanks to a stress-relief material between the leads and the sealing resin. The high mounting strength allows for an alternative to the gull-wing type package, making it effective for miniaturization and low-profile design in automotive applications. 【Features】 ■ Patented technology: Patent No. 2015-139062 (Application date: July 10, 2015) ■ Push strength improved by 57% compared to gull-wing type packages ■ Substrate bending resistance improved by 66% due to the stress-relief material between the leads and sealing resin ■ High mounting reliability *For more details, please refer to the PDF document or feel free to contact us.